Home >> Products
 
Multi-layer FPC
 
Multi-layer FPC
It is an advance product developed from double-sided FPC. Increasing the complexity of circuits to greater degrees, it is typically applied in current high tech digital products, especially in circuits of color screen mobiles phoness.
 
*Multilayer FPC - Material: Polyimide, Copper; Copper: 0.5 oz, RA; Cover layer: Polyimide, 0.5 mil; Thickness: 0.23+0.05mm; Line Width/Space: 6mil/6mil; Surface Finishing: Immersion Gold; Smallest Hole Diameter: 0.3mm.
*Multilayer FPC - Material: Polyimide, Copper; Copper: 0.5 oz, RA; Cover layer: Polyimide, 0.5 mil; Thickness: 0.23+0.05mm; Line Width/Space: 5.7mil/6mil; Surface Finishing: Immersion Gold; Smallest Hole Diameter: 0.3mm.

 

 

 

JASPER ELECTRONICS CO.,LTD

E-mail:sales@malcolmandmartin.com
Copyright © 2006 All rights Reserved.

Membrane Switches
Nameplate / Label
Membrane Circuit
EL Backlight
Rubber Products
In-Mould Decoration
Flexible PCB
Rigid PCB
Circuit Assemblies
Circuit Design & Layout
Prototype & Pilot Run